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Next
Generation of Lead-free Solder : Sn/Zn/Al
Alloy |
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Solution
to your lead-free soldering needs ! |
| Characteristics of Sn/Zn/Al Solder Paste (No-Clean Type) |
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Sn/Zn/Al Solder Paste |
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| Particle Size |
20µm – 45µm |
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| Flux Content |
11.5 ± 0.5% |
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| Halide Content |
0.03 ± 0.015% |
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| Viscosity |
170 ± 20 Pa•s |
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| Electric Insulating Resistance |
40°C@90% RH after 168
hrs |
1e10 Ohms or Above |
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85°C@85% RH after 168 hrs |
5 x 10e8 Ohms or Above |
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| Causticity of Residual Flux |
No Decay
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| Causticity to Cu Plated Substrate |
No Decay
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| Printability |
Possible to print up to M 3 pattern
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| Wetting Effect and De-Wetting Test |
Class 2 (Copper Plate) |
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| Resistibility to Aquatic Solution |
Above 500 Ohm•m |
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| Migration |
Not to Occur |
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| Physical Properties of Sn/Zn/Al Solder Paste (No-Clean Type) |
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Sn/Zn/Al Solder Paste |
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| Melting Temperature |
199°C – 205°C |
| Reflow Peak Temperature |
215°C |
| Tensile Strength |
55 MPa |
| Elongation |
36% |
| Special Notes: | |||
| 1. | Recommended storing condition and quality guarantee period are as follows; | ||
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| 2. | Prior to application of the paste, leave the paste at proper place in the room to bring back to the room temperature. Avoid rapid heating of the paste from the stored temperature to working temperature. | ||
| 3. | Recommended working environment is as follows; | ||
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| 4. | Cleaning of the stencil must be thorough to avoid any contamination from the residue and/or solvents which may cause degradation of the solderability fo the paste. | ||
| 5. | Recommended Reflow Profile | ||
| Typical reflow profile guideline for Sn/Zn/Al solder paste is shown below. | |||
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