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Next
Generation of Lead-free Solder : Sn/Zn/Al
Alloy |
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Solution
to your lead-free soldering needs ! |
| Portable Paste Mixer |
| • | Uniform mixing of Flux and Solder Powder | |
| • | Paste be ready to use in 15 minutes | |
| (No need to wait for the paste to reach the room temperature) | ||
| • | Elimination of Condensation | |
SC-HNE |
• | Portable and very easy to operate |
When a lid is open immediately after paste is taken out from the storage place (refrigerator), the condensation will occur inside of the paste. Such moisture evaporates quickly during a soldering process and may cause defective solder connections. |
| By mixing the paste ultrasonically without opening the lid and slowly increase the temperature as the flux and solder powder mix uniformly, condensation will be eliminated. |
| In Case of 500g Paste: |
| 1. | Pure room temperature water into Cleaning Cup up to a depth of 3/8” (10mm). | ||
| 2. | Place the paste container inside the cup. | ||
| 3. | Turn On the machine by using a timer for around 15 minutes. | ||
| Note: | The mixing time is depending on the quantity and type of the paste. | ||
| 4. | Take the paste out from the cup and NOW the paste is ready for printing. | ||
| Note: | Check the outside temperature of the container before opening of the lid. | ||
| Cleaning of Nozzle |
| Clean the nozzle within 3 seconds | ||
| 1. | Pure solvent in the cup. | |
| 2. | Dip the tip of the nozzle into the solvent. | |
| 3. | Turn "ON" the machine and blow air through the nozzle for 2~3 seconds (or until bubbles appear). | |